Process Temperature–Dependent Mechanical Properties of...

Journal of Microelectromechanical Systems 2007 / 04 Vol. 16; Iss. 2

Process Temperature–Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structure

Kamiya, Shoji, Kuypers, Jan H., Trautmann, Achim, Ruther, Patrick, Paul, Oliver
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Volume:
16
Language:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/jmems.2007.892920
Date:
April, 2007
File:
PDF, 1.06 MB
english, 2007
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