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[IEEE 2002 8th International Advanced Packaging Materials Symposium - Stone Mountain, GA, USA (3-6 March 2002)] 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) - The role of stiff base substrates in warpage reduction for future high-density-wiring requirements
Banerji, S., Markondeya Raj, P., Fuhan Liu,, Shinotani, K., Bhattacharya, S., Tummala, R.R.Year:
2002
Language:
english
DOI:
10.1109/isapm.2002.990390
File:
PDF, 498 KB
english, 2002