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[IEEE IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium - San Jose, CA, USA (14-16 July 2004)] IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) - Development of novel packaging structures encapsulation process, materials and reliability for matrix array over-molded flip chip CSP
Kai-Chi Chen,, Hsun-Tien Li,, Nemoto, T., Shu-Chen Huang,, Fukui, T., Tzong-Ming Lee,, Kitamura, K., Tsuji, T.Year:
2004
Language:
english
DOI:
10.1109/IEMT.2004.1321643
File:
PDF, 435 KB
english, 2004