[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Creep Behavior of Mixed SAC 405/SnPb Soldered Assemblies in Shear Loading
Limaye, Paresh, Labie, Riet, Vandevelde, Bart, Vandepitte, Dirk, Verlinden, BertYear:
2007
Language:
english
DOI:
10.1109/eptc.2007.4469836
File:
PDF, 834 KB
english, 2007