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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - The Influence of Electromigration and Aging on the Reliability of SnAgCu Lead-Free Solder Joint at 100°C
Wei, Guoqiang, Yao, Jian, Shi, YonghuaYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066987
File:
PDF, 1.12 MB
english, 2011