[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Fracture analysis of interface delamination in Metal-Insulator-Metal capacitor device
Hsieh, Ming-Che, Sheng-Tsai Wu,, Chao-Huang Chen,Year:
2010
Language:
english
DOI:
10.1109/estc.2010.5642862
File:
PDF, 1.87 MB
english, 2010