[IEEE 2010 3rd Electronic System-Integration Technology...

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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Fracture analysis of interface delamination in Metal-Insulator-Metal capacitor device

Hsieh, Ming-Che, Sheng-Tsai Wu,, Chao-Huang Chen,
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Year:
2010
Language:
english
DOI:
10.1109/estc.2010.5642862
File:
PDF, 1.87 MB
english, 2010
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