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[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Low temperature bonding using sub-micron Au particles for wafer-level MEMS packaging
Ito, Shin, Mizuno, Jun, Ishida, Hiroyuki, Ogashiwa, Toshinori, Kanehira, Yukio, Murai, Hiroshi, Wakai, Fumihiro, Shoji, ShuichiYear:
2012
Language:
english
DOI:
10.1109/icsj.2012.6523451
File:
PDF, 316 KB
english, 2012