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Reliability prediction for TFBGA assemblies
Radivojevic, Z., Abdul-Quadir, Y., Myllykoski, P., Rantala, J.Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2006.875889
Date:
June, 2006
File:
PDF, 2.29 MB
english, 2006