[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - WSS and ZoneBOND temporary bonding techniques comparison for 80μm and 55μm functional interposer creation
Jouve, A., Vial, K., Rolland, E., Coudrain, P., Aumont, C., Laviron, C., Fournel, F., Pellat, M., Montmeat, P., Allouti, N., Eleouet, R., Argoud, M., Dechamp, J., Bally, L., Vignoud, L., Donche, C., HYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575557
File:
PDF, 1.61 MB
english, 2013