[IEEE 2008 IEEE International Symposium on Electromagnetic Compatibility - EMC 2008 - Detroit, MI (2008.08.18-2008.08.22)] 2008 IEEE International Symposium on Electromagnetic Compatibility - Impact of thermal stress on the characteristics of conducted emissions
Montanari, I., Tacchini, A., Maini, M.Year:
2008
Language:
english
DOI:
10.1109/isemc.2008.4652103
File:
PDF, 511 KB
english, 2008