![](/img/cover-not-exists.png)
[IEEE IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA (23-25 Oct. 2000)] IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) - Over 20 GHz microwave frequency model of fine pitch ball grid array (FPBGA) bonding
Junho Lee,, Seungyoung Ahn,, Jaeyoung Ryu,, Joungho Kim,Year:
2000
Language:
english
DOI:
10.1109/EPEP.2000.895505
File:
PDF, 292 KB
english, 2000