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[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Analysis of via distribution effect on multi-layered power/ground transfer impedance of high-performance packages
Hyungsoo Kim,, Jingook Kim,, Youchul Jeong,, Jongbae Park,, Joungho Kim,Year:
2002
Language:
english
DOI:
10.1109/epep.2002.1057908
File:
PDF, 338 KB
english, 2002