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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Numerical and experimental investigation of board level reliability of TEFCBGA
Ma, Y.Y., Lenzi, M., Loo, K.W., Ho, P.S., Luan, J.E., Baraton, X.Year:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416479
File:
PDF, 689 KB
english, 2009