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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Packaging of SiC-SBD for high temperature operation
Valdez-Nava, Zarel, Kozako, Masahiro, Dinculescu, Sorin, Omura, Ichiro, Hikita, Masayuki, Lebey, ThierryYear:
2012
Language:
english
DOI:
10.1109/emap.2012.6507921
File:
PDF, 821 KB
english, 2012