[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Microstructure evolution in microbumps for 3D-IC packaging
Yang, Ruo-Wei, Chang, Yuan-Wei, Chen, Chih, Chang, Tao-Chih, Zhan, Chau-Jie, Juang, Jin-YeYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699610
File:
PDF, 359 KB
english, 2010