[IEEE 2009 4th International Microsystems, Packaging,...

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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Electrical characterization of fine-pitch compliant bumps

Lin, C. K., Chih Chen,, Shyh-Ming Chang,, Chao-Chyun An,, Hsiao Ting Lee,, Kuo-Shu Kao,, Jimmy Tsang,, Sheng-Shu Yang,
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Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382201
File:
PDF, 2.29 MB
english, 2009
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