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[IEEE 1996 46th Electronic Components and Technology Conference - Orlando, FL, USA (28-31 May 1996)] 1996 Proceedings 46th Electronic Components and Technology Conference - Bottom leaded plastic (BLP) package: a new design with enhanced solder joint reliability
Young-Gon Kim,, Bongtae Han,, Shin Choi,, Myung-Ki Kim,Year:
1996
Language:
english
DOI:
10.1109/ectc.1996.517425
File:
PDF, 580 KB
english, 1996