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[IEEE 2007 IEEE Electrical Performance of Electronic Packaging - Atlanta, GA, USA (2007.10.29-2007.10.31)] 2007 IEEE Electrical Performance of Electronic Packaging - Efficient Full-Wave Analysis of Multilayer Interconnection Structures Using a Novel Domain Decomposition-Model Order Reduction Method
Lee, Shih-Hao, Jin, Jian-MingYear:
2007
Language:
english
DOI:
10.1109/epep.2007.4387126
File:
PDF, 875 KB
english, 2007