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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Pb-free solder joint reliability of fine pitch chip-scale packages
Xie, Weidong, Lee, Tae-Kyu, Liu, Kuo-Chuan, Xue, JieYear:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490777
File:
PDF, 1.97 MB
english, 2010