[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Characterization and modeling of solder balls and through-strata-vias (TSVs) in 3D architecture
Xu, Zheng, Beece, Adam, Zhang, Dingyou, Chen, Qianwen, Rose, Kenneth, Lu, Jian-QiangYear:
2010
Language:
english
DOI:
10.1109/epeps.2010.5642538
File:
PDF, 1020 KB
english, 2010