[IEEE First International IEEE Conference on Polymers and...

  • Main
  • [IEEE First International IEEE...

[IEEE First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. - Potsdam, Germany (21-24 Oct. 2001)] First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) - Fracture mechanical analysis of cracks in polymer encapsulated metal structures

Wittler, O., Sprafke, P., Auersperg, J., Michel, B., Reichl, H.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2001
Language:
english
DOI:
10.1109/polytr.2001.973281
File:
PDF, 529 KB
english, 2001
Conversion to is in progress
Conversion to is failed