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[IEEE First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. - Potsdam, Germany (21-24 Oct. 2001)] First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) - Fracture mechanical analysis of cracks in polymer encapsulated metal structures
Wittler, O., Sprafke, P., Auersperg, J., Michel, B., Reichl, H.Year:
2001
Language:
english
DOI:
10.1109/polytr.2001.973281
File:
PDF, 529 KB
english, 2001