[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Out-of-plane connection in an orthogonal assembly
Tan Kwan Ling,, Ding Mian Zhi,, Yao Lei,, Yee Tack Boon,, Je Minkyu,, Cheng Ming-Yuan,Year:
2012
Language:
english
DOI:
10.1109/eptc.2012.6507046
File:
PDF, 910 KB
english, 2012