[IEEE 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) - Irvine, CA (2013.2.27-2013.3.1)] 2013 IEEE International Symposium on Advanced Packaging Materials - Silver-indium phase diagram and its applications to electronic packaging
Yuan-Yun Wu,, Lin, Wen P., Lee, Chin C.Year:
2013
Language:
english
DOI:
10.1109/isapm.2013.6510386
File:
PDF, 1.15 MB
english, 2013