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[IEEE 2002 IEEE International Reliability Physics Symposium Proceedings. 40th Annual - Dallas, TX, USA (7-11 April 2002)] 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) - Stress-induced voiding under vias connected to wide Cu metal leads
Ogawa, E.T., McPherson, J.W., Rosal, J.A., Dickerson, K.J., Chiu, T.-C., Tsung, L.Y., Jain, M.K., Bonifield, T.D., Ondrusek, J.C., McKee, W.R.Year:
2002
Language:
english
DOI:
10.1109/RELPHY.2002.996654
File:
PDF, 884 KB
english, 2002