Fill Pattern and Particle Distribution of Underfill...

IEEE Transactions on Components and Packaging Technologies 2004 / 09 Vol. 27; Iss. 3

Fill Pattern and Particle Distribution of Underfill Material

Huang, Y., Bigio, D., Pecht, M.G.
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Volume:
27
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2004.831776
Date:
September, 2004
File:
PDF, 1.85 MB
english, 2004
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