Feature - From chips to systems via packaging - A...

IEEE Circuits and Systems Magazine 2006 Vol. 6; Iss. 4

Feature - From chips to systems via packaging - A comparison of IBM's mainframe servers

Harrer, H., Katopis, G.A., Becker, W.
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Volume:
6
Year:
2006
Language:
english
Journal:
IEEE Circuits and Systems Magazine
DOI:
10.1109/mcas.2006.264840
File:
PDF, 1.95 MB
english, 2006
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