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[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - Modelling the Lamination Process for Ruggedised Displays
Yek Bing Lee,, Bailey, C., Hua Lu,, Riches, S., Bartholomew, M., Tebbit, N.Year:
2005
Language:
english
DOI:
10.1109/emap.2005.1598269
File:
PDF, 3.19 MB
english, 2005