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[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Post etch residue removal: novel dry clean technology using densified fluid cleaning (DFC)

Beery, D., Reinhardt, K., Smith, P.B., Kelley, J., Sivasothy, A.
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Year:
1999
Language:
english
DOI:
10.1109/iitc.1999.787102
File:
PDF, 394 KB
english, 1999
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