![](/img/cover-not-exists.png)
[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - A noble metallization process using Preferential Metal Deposition (PMD)-aluminum with methylpyrroridine alane (MPA)
Jong Myeong Lee,, Byung Hee Kim,, Ju Young Yun,, Myoung Bum Lee,, Gil Heyun Choi,, Young Wook Park,, Hyun Koock Shin,, Sang In Lee,, Joo Tae Moon,Year:
2001
Language:
english
DOI:
10.1109/IITC.2001.930021
File:
PDF, 242 KB
english, 2001