RF packaging and passives: design, fabrication, measurement, and validation of package embedded inductors
Chickamenahalli, S.A., Braunisch, H., Srinivasan, S., Jiangqi He,, Shrivastava, U., Sankman, B.Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.850510
Date:
November, 2005
File:
PDF, 1.12 MB
english, 2005