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Junction temperature considerations in evaluating electronic parts for use outside manufacturers-specified temperature ranges
Condra, L., Das, D., Pendse, N., Pecht, M.G.Volume:
24
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.974966
Date:
January, 2001
File:
PDF, 147 KB
english, 2001