![](/img/cover-not-exists.png)
[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Compliant pin interconnect challenging and reliability after RoHS exemption
He, David, Xiang, Yu, Chung, DF, Wang, Paul, Hu, Livia, Dayal, Bobby, Sauter, Karl, Norman, Tim, Martinez_Vargas, JorgeYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474757
File:
PDF, 3.47 MB
english, 2012