[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Reliability of paste based transient liquid phase sintered interconnects
Greve, Hannes, Moeini, S. Ali, McCluskey, F. PatrickYear:
2014
DOI:
10.1109/ectc.2014.6897462
File:
PDF, 3.88 MB
2014