[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - A study of fluid coolant with carbon nanotube suspension for microchannel coolers
Yi Fan,, Yifeng Fu,, Yan Zhang,, Teng Wang,, Xiaojing Wang,, Zhaonian Cheng,, Johan Liu,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607042
File:
PDF, 308 KB
english, 2008