[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China...

  • Main
  • [IEEE High Density Packaging...

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - A study of fluid coolant with carbon nanotube suspension for microchannel coolers

Yi Fan,, Yifeng Fu,, Yan Zhang,, Teng Wang,, Xiaojing Wang,, Zhaonian Cheng,, Johan Liu,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607042
File:
PDF, 308 KB
english, 2008
Conversion to is in progress
Conversion to is failed