[IEEE 2011 IEEE 61st Electronic Components and Technology...

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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC Stacking

Xie, Ling, Choi, Won Kyoung, Premachandran, C. S., Selvanayagam, Cheryl S., Bai, Ke Wu, Zeng, Ying Zhi, Ong, Siong Chiew, Liao, Ebin, Khairyanto, Ahmad, Sekhar, V. N., Thew, Serene
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Year:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898526
File:
PDF, 1.85 MB
english, 2011
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