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[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - Novel seed layer formation using direct electroless copper deposition on ALD-Ru layer for high aspect ratio TSV

Inoue, F., Philipsen, H., Radisic, A., Armini, S., Civale, Y., Leunissen, P., Shingubara, S.
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Year:
2012
Language:
english
DOI:
10.1109/iitc.2012.6251660
File:
PDF, 6.11 MB
english, 2012
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