[IEEE 2014 4th IEEE International Workshop on Low...

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[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - GaN on h-BN technology for release and transfer of nitride devices

Hiroki, Masanobu, Kumakura, Kazuhide, Kobayashi, Yasuyuki, Akasaka, Tetsuya, Yamamoto, Hideki, Makimoto, Toshiki
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Year:
2014
Language:
english
DOI:
10.1109/LTB-3D.2014.6886170
File:
PDF, 234 KB
english, 2014
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