[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - GaN on h-BN technology for release and transfer of nitride devices
Hiroki, Masanobu, Kumakura, Kazuhide, Kobayashi, Yasuyuki, Akasaka, Tetsuya, Yamamoto, Hideki, Makimoto, ToshikiYear:
2014
Language:
english
DOI:
10.1109/LTB-3D.2014.6886170
File:
PDF, 234 KB
english, 2014