[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Mechanical analysis of Ultra-Thin-Chip-on-Flex (UTCOF) with anisotropic conductive adhesive (ACA) joints

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