Microwave circuits in multilayer inorganic-organic polymer...

IEEE Transactions on Advanced Packaging 2003 / 02 Vol. 26; Iss. 1

Microwave circuits in multilayer inorganic-organic polymer thin film technology on laminate substrates

Johansson, C., Uhlig, S., Tageman, O., Alping, A., Haglund, J., Robertsson, M., Popall, M., Frohlich, L.
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Volume:
26
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2003.811548
Date:
February, 2003
File:
PDF, 848 KB
english, 2003
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