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[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermal characterization of high-density interconnects: A methodolgy tested on a model coupon
Nakayama, Wataru, Koizumi, Katsuhiro, Fukue, Takashi, Ishizuka, Masaru, Nakajima, Tatsuya, Ohta, Hiroko, Matsuki, RyuichiYear:
2010
Language:
english
DOI:
10.1109/itherm.2010.5501402
File:
PDF, 485 KB
english, 2010