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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Parametric acceleration transforms for lead-free solder joint reliability under thermal cycling conditions
Ahmad, Mudasir, Weidong Xie,, Liu, Kuo-Chuan, Jie Xue,, Towne, DaveYear:
2009
Language:
english
DOI:
10.1109/ECTC.2009.5074087
File:
PDF, 843 KB
english, 2009