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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Wafer-level chip-to-Wafer (C2W) integration of high-sensitivity MEMS and ICs
Xu, Gaowei, Yan, Peili, Chen, Xiao, Ning, Wenguo, Luo, Le, Jiao, JiweiYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066804
File:
PDF, 3.30 MB
english, 2011