[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Analysis of the Induced Stresses in Silicon During Thermcompression Cu-Cu Bonding of Cu-Through-Vias in 3D-SIC Architecture
Okoro, Chukwudi, Gonzalez, Mario, Vandevelde, Bart, Swinnen, Bart, Eneman, Geert, Stoukatch, Serguei, Beyne, Eric, Vandepitte, DirkYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373805
File:
PDF, 6.00 MB
english, 2007