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[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Recent progress in copper-based wafer bonding for 3-D ICs application
Tan, Chuan SengYear:
2008
Language:
english
DOI:
10.1109/emap.2008.4784225
File:
PDF, 1.50 MB
english, 2008