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[IEEE 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Atlanta, GA, USA (15-17 March 2006)] 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Materials Challenges and Solutions for the Packaging of High Power LEDs
Grant Lin,, Yan Zhou,, Nugen Tran,, Weichun Chiang,, Yongzhi He,, Shi, F.G.Year:
2006
DOI:
10.1109/ISAPM.2006.1665998
File:
PDF, 351 KB
2006