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[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Dissolution behaviors of the Ni and Ni3Sn4 phase in molten lead-free solders
Yee-wen Yen,, Meng-Han Kuo,, Wei-Kai Liou,, Tai-Ni Chu,Year:
2012
Language:
english
DOI:
10.1109/impact.2012.6420288
File:
PDF, 2.09 MB
english, 2012