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[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Life time prediction for lead-free solder joints under vibration loads
Meier, Karsten, Roellig, Mike, Schiessl, Andreas, Wolter, Klaus-JuergenYear:
2011
Language:
english
DOI:
10.1109/ESIME.2011.5765838
File:
PDF, 2.59 MB
english, 2011