Reliability Analysis of Lead-Free Solder Castellations

IEEE Transactions on Components and Packaging Technologies 2008 / 03 Vol. 31; Iss. 1

Reliability Analysis of Lead-Free Solder Castellations

Salmela, O., Nieminen, T., Sarkka, J., Tammenmaa, M.
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.906705
Date:
March, 2008
File:
PDF, 1.37 MB
english, 2008
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