Numerical Investigation of Thermal Contact Resistance...

Numerical Heat Transfer, Part A: Applications 2006 / 10 Vol. 49; Iss. 7

Numerical Investigation of Thermal Contact Resistance between the Mold and Substrate on Laser-Assisted Imprinting Fabrication

Hsiao, Fei-Bin, Wang, Di-Bao, Jen, Chun-Ping
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Volume:
49
Language:
english
Journal:
Numerical Heat Transfer, Part A: Applications
DOI:
10.1080/10407780500496612
Date:
October, 2006
File:
PDF, 1.07 MB
english, 2006
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