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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Electro-migration behavior in low temperature flip chip bonding
Murayama, Kei, Higashi, Mitsutoshi, Sakai, Taiji, Imaizumi, NobuakiYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248893
File:
PDF, 949 KB
english, 2012